only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 1 05192 ULL0402FC05C low capacitance un b u m pe d flip c h ip t vs arra y de s cription the ullc0402fc05c flip chip employs advanced silicon p/n juncton technology for unmatched board-level transient voltage protecton against electrostatc dis - charge (esd) and electrical fast transients (eft). developed specifcally for high-density circuit protecton, this series meets the iec 61000-4-2 and 61000-4-4 require - ments. these devices are ideally suited for handheld devices, pcmcia and smart cards. this low capacitance device provides esd protecton greater than 25 kilovolts with a peak pulse power dissipaton of 200 wats per line for an 8/20s waveform. in additon, the ullc0402fc05c features superior clamping performance, low leakage current characteristcs and a response tme of less than a nanosecond. their low inductance virtually eliminates overshoot voltage due to package inductance. f eature s ? compatble with iec 61000-4-2 (esd): air 15kv, contact 8kv ? compatble with iec 61000-4-4 (eft): 40a, 5/50ns ? esd protecton > 25 kilovolts ? low esd overshoot voltage ? bidirectonal and monolithic structure ? protecton for 1 line ? low capacitance: 6pf ? low leakage current ? rohs compliant ? reach compliant mec h anical c h aracteri s tic s ? standard eia chip size: 0402 ? approximate weight: 0.73 milligrams ? lead-free platng ? flammability ratng ul 94v-0 ? 8mm plastc tape per eia standard 481 application s ? smart phones ? portable electronics ? smart cards pin configuration
only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 2 05192 ULL0402FC05C t y pical d e v ice c h aracteri s tic s m axi m u m rating s @ 25c unless otherwise specifed para m eter symb ol v alue unit s operatng temperature t a -55 to 150 c storage temperature t stg -55 to 150 c electrical c h aracteri s tic s per line @ 25c unless otherwise specifed part nu mb er (note 1) rate d s tan d -off v oltage v w m v olt s m ini m u m b reak d own v oltage @ 1 m a v ( b r) v olt s m axi m u m leakage current @ v w m i d a t y pical capacitance @0 v , 1 mh z c p f ullc0402fc05c 5.0 6.0 1.0 6 note s 1. device is bidirectonal.
only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 3 05192 ULL0402FC05C t y pical d e v ice c h aracteri s tic s figure 1 o v er sh oot & cla m ping v oltage e sd test pulse - 25 kilovolt, 1/30ns (waveshape) 5 v olts per division -5 5 15 25 35 figure 2 capacitance vs re v er s e v oltage v r - reverse v oltage - v olts 0 2 4 6 0 4 8 cj - capactance - pf
only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 4 05192 ULL0402FC05C s ol d er reflow infor m ation printe d circuit b oar d reco mm en d ation s para m eter v alue pad size on pcb 0.275mm pad shape round pad defniton non-solder mask defned pads solder mask opening 0.325mm round solder stencil thickness 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.330mm round solder paste type no clean pad protectve finish osp (entek cu plus 106a) tolerance - edge to corner ball 50m solder ball side coplanarity (only applies to bumped devices) 20m maximum dwell time above liquidous (183c) 60 seconds soldering maximum temperature 270c t p 30-60 seconds ramp-up 15 seconds (m inimize) s older-time 15-20 seconds ramp-d own ramp-d own solder melt (m aximum temp) m aximum s older refow (35-53c above m aximum solder m elt temp) ramp-up preheat (s tay b elow flux actvaton temp) temperature - c reco mm en d e d non -s ol d er m a s k d efine d pa d illu s tration non-solder mask d efned pad 0.275mm d ia. solder mask opening 0.325mm d ia. solder s tencil opening 0.330mm d ia. r e q uire m ent s temperature: t p for lead-free (sn/ag/cu): 260-270c preheat tme and temperature depends on solder paste and fux actva - ton temperature, component size, weight, surface area and platng.
only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 5 05192 ULL0402FC05C u0402 package infor m ation outline d i m en s ion s d i m m illi m eter s inc h e s m in m ax m in m ax a 0.61 0.024 b 0.86 0.034 c 0.98 1.02 0.038 0.040 d 0.10 0.004 e 0.35 0.014 f 0.458 0.508 0.018 0.020 i 0.406 0.016 n ote s 1. controlling dimensions in inches. 2. decimal tolerance: .xxx 0.05mm (0.002). 3. maximum chip size: 1.02mm (0.040) by 0.51mm (0.020). la y out d i m en s ion s d i m m illi m eter s inc h e s no m inal no m inal a 0.23 0.009 b 0.48 0.019 c 0.69 0.027 d 0.46 0.018 e 0.99 0.039 f 0.20 0.008 g 0.20 0.008 h 0.66 0.026 i 0.13 0.005 n ote s 1. controlling dimensions in inches. 2. decimal tolerance: .xxx 0.05mm (0.002). c b a d h f e g die contacts solder p ad die solder print diameter 0.010 - 0.012 t op a b c d e f metalized die contacts end i side i
only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 6 05192 ULL0402FC05C tape an d reel infor m ation 10 pitches cumulatve tolerance on tape 0.2 w f b0 e p2 p0 d p a0 k0 t user directon of feed top cover tape s pecification s r eel dia . t ape w i d t h a0 b 0 k0 d e f w p0 p2 p t max 178(7) 8 0.70 0.05 1.15 0.10 0.56 0.05 1.55 0.05 1.75 0.10 3.50 0.05 8.00 0.20 4.00 0.05 2.00 0.05 2.00 0.05 0.25 n ote s 1. dimensions in millimeters. 2. top view of tape. metal contacts are face down in tape package. 3. orientaton: preferred stencil - 0.1mm (0.004). 4. surface mount product is taped and reeled in accordance with eia 481. 5. 8mm plastc tape: 7 reels - 5,000 (pocket under hole skipped) or 10,000 pieces per reel. 6. marking on reel - part number, date code and lot number. tape & reel orientation single die - 0402 package outline, pad layout and tape specifcatons per document number 06001.r5 8/10. or d ering infor m ation b a s e part nu mb er lea d free s uffix tape s uffix q t y /reel reel s ize tu b e q t y ullc0402fc05c -n/a -t75-1 5,000 7 n/a ullc0402fc05c -n/a -t710-1 10,000 7 n/a
only one name means protektion? www.protekdevices.com 05192.r5 2/11 page 7 05192 ULL0402FC05C co m pan y infor m ation co m pany profile protek devices, based in tempe, arizona usa, is a manufacturer of transient voltage suppression (tvs) products designed specifcally for the protecton of electronic systems from the efects of lightning, electrostatc discharge (esd), nuclear electromagnetc pulse (nemp), in - ductve switching and emi/rfi. with over 25 years of engineering and manufacturing experience, protek designs tvs devices that provide applicaton specifc protecton solutons for all electronic equipment/systems. protek devices analog products division, also manufactures analog interface, control, rf and power management products. copyright ? protek devices 2007 - this literature is subject to all applicable copyright laws and is not for resale in any manner. specifications: protek reserves the right to change the electrical and or mechanical characteristcs described herein without notce. design changes: protek reserves the right to discontnue product lines without notce and that the fnal judgement concerning selecton and specifcatons is the buyers and that in furnishing engineering and technical assistance. protek assumes no responsibility with respect to the selecton or specifcatons of such products. protek makes no warranty, representaton or guarantee regarding the suitability of its products for any partcular purpose, nor does protek assume any liability arising out of the applicaton or use of any product or circuit and specifcally disclaims any and all liability without limitaton special, consequental or incidental damages. life support policy: protek devices products are not authorized for use in life support systems without writen consent from the factory. patent information: this device is patented under u.s. patent no. des. 6,867,436. contact u s corporate h eadquarters 2929 south fair lane tempe, arizona 85282 usa b y telephone general: 602-431-8101 sales: 602-414-5109 customer service: 602-414-5114 b y fax general: 602-431-2288 b y e-mail: sales: sales@protekdevices.com customer service: service@protekdevices.com technical support: support@protekdevices.com web www.protekdevices.com www.protekanalog.com
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